Xiaomi on August 24 unveiled three new TSMC-fabricated chips under its Xring brand, headlined by the 3nm Xring O3 – reportedly the world first mobile processor to support LPDDR6 memory.
The O3, already in mass production with 200,000 to 300,000 units targeting an upcoming Xiaomi 18 Fold, delivers memory bandwidth of 113.8 GB/s at speeds up to 10,667 Mbps – a 48 percent increase over its predecessor, the Xring O1. The chip packs 24 billion transistors into a 133 mm2 die and scored over 5 million on the AnTuTu benchmark, according to reports from EE Times China and IT Home.
On-Device AI With MiMo
The O3 NPU has been completely redesigned to run Xiaomi MiMo large language model on-device. It delivers up to 200 TOPS of tensor performance and 3.13 TFLOPS of vector performance, boosting on-device AI capability by 45 percent compared to the previous generation. The chip will also appear in the Xiaomi Pad 9 Pro Max tablet.
A second chip, the 6nm Xring O100, is a dedicated AI accelerator using 3D wafer-on-wafer stacking. Xiaomi CEO Lei Jun shared specifications on Weibo showing the O100 delivers bandwidth up to 1.22 TB/s through hybrid bonding at a 1.4 micrometer pitch – making it the industry first 6nm WoW 3D advanced packaging solution, per TrendForce.
Autonomous Driving Silicon
The third chip, the Xring D100, is described as China first 3nm high-compute AI chip for intelligent driving. It combines a 20-core high-performance CPU with a 16-core NPU and supports up to 160 GB of unified memory, enough to locally run AI models with up to 200 billion parameters. Development is complete and commercial deployment is planned for next year.
The three-product launch represents Xiaomi most aggressive move yet to reduce reliance on Qualcomm and MediaTek, both of which dominate the Android mobile chip market. By designing its own silicon optimized for its MiMo AI models, Xiaomi aims to control the full stack from chip to software for its expanding device ecosystem.
The announcements come amid a broader trend of Chinese smartphone makers investing in custom silicon. Huawei has been designing its own Kirin chips since 2020 under US sanctions, while OPPO and vivo have explored custom image processors. Xiaomi bet on TSMC 3nm process gives it access to leading-edge manufacturing while its competitors weigh the tradeoffs between in-house design and foundry partnerships.
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